CNET
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[Link to CNET - Summary of QCOM Summit - 24th September 2025](https://youtu.be/_lEhZtSDsag?si=d8tUJtVO9-7awIFZ)
QCOM has delivered SD X2 with incredible performance at low power consumption ideally suited for fanless ultrabooks.
What to expect from AMD and Intel with x86 architectures?
| Aspect | QCOM SD X2 Elite Extr. | AMD Zen 6 (Rumored) |
|-------------------------|-------------------------------------------------------|-------------------------------------------------------|
| **Architecture** | Arm-based (3rd-gen custom Oryon CPU cores) | x86-based (Zen 6 "Morpheus" microarchitecture) |
| **Process Node** | TSMC 3nm | TSMC 3nm (N3P) or 2nm (N2) for select variants |
| **Core Config** | Up to 18 cores (12x Oryon Prime performance cores + 6x performance cores); no efficiency cores | Up to 24 cores in desktop configs (2x 12-core CCDs; 8-core CCDs in some variants); potential hybrid design with performance/dense cores |
| **Clock Speeds** | Up to 5.0 GHz boost (2 cores); 4.4 GHz multi-core | Rumored up to 7.0 GHz boost; multi-core ~4.5-5.5 GHz (based on Zen 5 scaling) |
| **Cache** | 53 MB total (L1/L2/L3 combined) | Up to 128 MB L3 (standard); up to 144 MB in X3D variants with 50% more 3D V-Cache |
| **GPU** | Integrated Adreno X2-90 (up to 1.85 GHz; 2.3x perf/W over prior gen) | Integrated RDNA 5-based iGPU (up to 16-20 CUs rumored); discrete AMD Radeon support |
| **NPU/AI** | Hexagon NPU (80 TOPS INT8; claimed fastest for laptops) | XDNA 2 NPU (50-60+ TOPS rumored; Copilot+ ready) |
| **Memory Sup.** | LPDDR5X-9526 (up to 128+ GB); 192-bit bus, 228 GB/s bandwidth | DDR5 (up to 128 GB); potential DDR6 support; dual-channel controllers for higher bandwidth/low latency |
| **TDP/Power** | ~50W tested (scalable for laptops); up to 43% less power vs. prior gen | 65-170W (desktop); 15-55W (mobile); focus on perf/W gains via node shrink |
| **Connectivity** | Wi-Fi 7, Bluetooth 5.4, Snapdragon X75 5G (10 Gbps down) | PCIe 5.0/6.0 (up to 28 lanes); USB4; Wi-Fi 7 optional via chipset |
| **Timeline** | Devices in H1 2026 | Late 2026 (desktop/server); early 2027 (mobile APUs) |

[Link to CNET - Summary of QCOM Summit - 24th September 2025](https://youtu.be/_lEhZtSDsag?si=d8tUJtVO9-7awIFZ)
QCOM has delivered SD X2 with incredible performance at low power consumption ideally suited for fanless ultrabooks.
What to expect from AMD and Intel with x86 architectures?
| Aspect | QCOM SD X2 Elite Extr. | AMD Zen 6 (Rumored) |
|-------------------------|-------------------------------------------------------|-------------------------------------------------------|
| **Architecture** | Arm-based (3rd-gen custom Oryon CPU cores) | x86-based (Zen 6 "Morpheus" microarchitecture) |
| **Process Node** | TSMC 3nm | TSMC 3nm (N3P) or 2nm (N2) for select variants |
| **Core Config** | Up to 18 cores (12x Oryon Prime performance cores + 6x performance cores); no efficiency cores | Up to 24 cores in desktop configs (2x 12-core CCDs; 8-core CCDs in some variants); potential hybrid design with performance/dense cores |
| **Clock Speeds** | Up to 5.0 GHz boost (2 cores); 4.4 GHz multi-core | Rumored up to 7.0 GHz boost; multi-core ~4.5-5.5 GHz (based on Zen 5 scaling) |
| **Cache** | 53 MB total (L1/L2/L3 combined) | Up to 128 MB L3 (standard); up to 144 MB in X3D variants with 50% more 3D V-Cache |
| **GPU** | Integrated Adreno X2-90 (up to 1.85 GHz; 2.3x perf/W over prior gen) | Integrated RDNA 5-based iGPU (up to 16-20 CUs rumored); discrete AMD Radeon support |
| **NPU/AI** | Hexagon NPU (80 TOPS INT8; claimed fastest for laptops) | XDNA 2 NPU (50-60+ TOPS rumored; Copilot+ ready) |
| **Memory Sup.** | LPDDR5X-9526 (up to 128+ GB); 192-bit bus, 228 GB/s bandwidth | DDR5 (up to 128 GB); potential DDR6 support; dual-channel controllers for higher bandwidth/low latency |
| **TDP/Power** | ~50W tested (scalable for laptops); up to 43% less power vs. prior gen | 65-170W (desktop); 15-55W (mobile); focus on perf/W gains via node shrink |
| **Connectivity** | Wi-Fi 7, Bluetooth 5.4, Snapdragon X75 5G (10 Gbps down) | PCIe 5.0/6.0 (up to 28 lanes); USB4; Wi-Fi 7 optional via chipset |
| **Timeline** | Devices in H1 2026 | Late 2026 (desktop/server); early 2027 (mobile APUs) |