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Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging

Business Wire | Nov 3, 2026 7:00 AM EST

BILLERICA, Mass.--(BUSINESS WIRE)--Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, today announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging. “Growth in AI compute, from model training to inference, is intensifying power and heat-m

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