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REPAY to Attend Upcoming Conferences


Business Wire | May 12, 2021 08:30AM EDT

REPAY to Attend Upcoming Conferences

May 12, 2021

ATLANTA--(BUSINESS WIRE)--May 12, 2021--Repay Holdings Corporation (NASDAQ: RPAY) ("REPAY"), a leading provider of vertically-integrated payment solutions, today announced that the Company will participate in the following upcoming virtual investor conferences:

* On Wednesday, May 19, 2021, the Company will participate in a fireside chat at the Barclays Emerging Payments and Fintech Forum. The discussion will begin at 11:20am ET. * On Thursday, June 3, 2021, the Company will participate in a fireside chat at the William Blair 41st Annual Growth Stock Conference. The discussion will begin at 1:40pm ET.

The presentations will be webcast live from the Company's investor relations website at https://investors.repay.com/ under the "Events" section. An archive of the webcasts will be available at the same location on the website for 90 days.

About REPAY

REPAY provides integrated payment processing solutions to verticals that have specific transaction processing needs. REPAY's proprietary, integrated payment technology platform reduces the complexity of electronic payments for merchants, while enhancing the overall experience for consumers and businesses.

View source version on businesswire.com: https://www.businesswire.com/news/home/20210512005537/en/

CONTACT: Investor Relations Contact for REPAY: repayIR@icrinc.com

CONTACT: Media Relations Contact for REPAY: Kristen Hoyman (404) 637-1665 khoyman@repay.com






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