Lessengers Unveils Breakthrough 3.2T Glass-Substrate Near-Packaged Optics (NPO) Powered by Direct Optical Wiring (DOW) Technology
SEOUL, South Korea & MÁLAGA, Spain--(BUSINESS WIRE)--Lessengers, a pioneer in advanced optical interconnect solutions, today announced a major architectural milestone for high-performance computing (HPC) with the unveiling of its 3.2T glass-substrate near-packaged optics (NPO) platform at ECOC 2026 in booth 2184 at FYCMA in Malaga, Spain. Powered by the company’s proprietary direct optical wiring (DOW) technology, this new 3.2 Terabits-per-second (Tbps) architecture bypasses traditional packagi