ZDT prices US$800M ECB to expand AI server PCB push
Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on September 22, raising a total of US$800 million (about NT$25.224 billion). The company plans to issue the bonds on September 29 and list them on the Singapore Exchange, with proceeds to be used entirely to replenish working capital and support technology development for high-end products.