Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), the Beijing Superstring Memory Research Institute (SAMT), CXMT, and equipment maker NAURA Technology Group. The coordinated advance highlights both the momentum behind 3D DRAM and the technical hurdles still blocking mass production.