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Uranium Energy Corp.
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Uranium UEC will be big short term

\*\*Lisa Su’s opening keynote at the 2026 OCP Global Summit (“Building the Next Era of AI Infrastructure,” \~28 minutes, October 12, 2026) focused on open, full-stack infrastructure for agentic AI.\*\* She stressed that open collaboration accelerates innovation and gives customers better, more flexible solutions in a heterogeneous data center world (CPUs + GPUs + ASICs + other accelerators), rather than one-size-fits-all proprietary stacks. \### Market and Workload Context \- Inference is now dominant: Su called 2026 “the year of inference,” with inference expected to be roughly 60% of the market going forward, driven heavily by agentic workloads (which she noted have grown \~14x this year). Token generation has exploded (one figure cited was a 95x increase in monthly tokens over two years, reaching nearly 40 quadrillion inference tokens per month). \- Training clusters continue to scale (roughly 5x annual growth in scale since 2020). \- TAM updates: Data center AI accelerator market projected to approach \~$1.5 trillion by 2030. CPU TAM has been raised multiple times recently due to agentic demand; AMD now sees \~50% CAGR over the next 4–5 years to over $200 billion by 2030 (versus earlier single-digit growth expectations from a much smaller base). Core principle: “You don’t need the same compute for every question.” Route the right model and the right compute (CPU density/power, GPU acceleration, etc.) for the workload. Openness (hardware, networking, software) is foundational for choice and faster ecosystem progress. \### Helios (Rack-Scale AI Platform) — Now in Production One year after its OCP debut, \*\*Helios is ramping production. Shipments began in September 2026\*\* and continue through Q4 2026 into the first half of 2027. Initial systems are at leading customers including OpenAI, Meta, Microsoft, Oracle, and Anthropic. \- Architecture: 72-GPU unified accelerator domain (Instinct MI400/MI455X series) co-designed with EPYC “Venice” CPUs, Pensando networking, liquid cooling, and ROCm software. Built on the OCP Open Rack Wide standard (co-engineered with Meta and the community). One description cited \~4,600 Zen 6 cores and 18,000+ compute units in the rack. \- Positioning: Highest-performance open AI rack, with claims such as \~30% more tokens per dollar on leading models and strong throughput (e.g., \~17,000 tokens/second/GPU on DeepSeek R1 in some references). Supports open interconnects (UALink over Ethernet, Ultra Ethernet / UEC, with partners including Broadcom, Cisco, Arista, HPE, and others). \- Su described it as the most sophisticated and complex system AMD has built with partners, integrating compute, memory, networking, cooling, and software as one system for large-scale training and inference. \### Helion (New Open Agentic AI Rack Blueprint) Introduced as the “cousin” to Helios — an OCP-compliant, flexible rack specifically tailored for agentic AI. It is a standard \~21-inch rack (air- or liquid-cooled) that AMD is contributing to OCP. \*\*Partner systems are planned for availability starting in November 2026 (with support from Cisco, Dell, HPE, Lenovo, Supermicro, QCT, Wiwynn, Hon Hai, and others).\*\* \- Configurations are flexible and can be tailored: \- CPU-only for hyperscale (dedicated agent execution/orchestration/sandboxes, connecting to separate inference infrastructure): up to 32,000+ / 32,768 Zen 6 cores — described as the highest compute density in the industry and \~40% more cores than competing racks. \- All-in-one enterprise racks mixing EPYC CPUs + Instinct MI350-series GPUs (reports vary between up to 16 and up to 32 MI350P GPUs) + networking. \- Includes an integrated token/model router to direct agent requests across frontier and open-source models and match compute resources to the task (personal/dense agents, balanced enterprise agents, high-performance technical agents, etc.). \- Goal: Let customers match CPU core density, performance, and power to agentic workloads while remaining open and adaptable to existing infrastructure. \### CPU Roadmap Highlights — Venice and New Verano \- 6th-gen EPYC “Venice” (Zen 6) already underpins agentic racks: high-core-count parts (up to 256 cores) for dense CPU servers/agent sandboxes, and high-frequency options for GPU host nodes. \- New reveal: EPYC “Verano” (shown on stage for the first time). Described as a low-system-power design with six compute chiplets of 32 cores each (192 cores total), the first EPYC with an LPDDR memory interface, and increased CPU-to-GPU bandwidth optimized for AI host / accelerator-feeding roles. \*\*Production expected in the first half of 2027.\*\* \### Software and Ecosystem \- ROCm remains the open software foundation; AMD highlighted support for the top open AI communities and continued performance gains on the same hardware via software updates. \- Hyperloom (agentic optimization) was cited for improving performance (one figure was \~40% on 14,000+ Hugging Face models) by identifying bottlenecks in inference/agent workflows. \*\*Bottom line from the keynote:\*\* AI demand (especially inference and agents) requires more compute of every type, open standards at every layer (hardware, networking, software, rack designs), and deep ecosystem collaboration. AMD positioned its portfolio — from Helios rack-scale systems now shipping, to the flexible Helion agentic blueprint, Venice CPUs, and the new Verano AI-host CPU — as enabling choice and scaling from enterprise systems to large deployments without lock-in. Openness is repeatedly framed as the foundation for faster innovation and better customer outcomes.